X-Ray inspection equipment

Overview:
AX8200 is a new X-RAY inspection system with large capacity, high resolution and high magnification. Excellent inspection effect for BGA, CSP, flip chip inspection, semiconductor, packaged components, electronic connector module inspection, printed circuit board solder joint inspection, ceramic products, aerospace components, solar panels on large circuit boards Testing in special industries such as the battery industry. For large circuit boards and large panels (the same module can be placed) can be NC programmed and the automatic detection accuracy and repeat accuracy are high.
Applications:
●pcba solder joint inspection (BGA, CSP, POP and other components inspection)●Battery (defect detection of electrode pad welding point, detection of winding of battery core)●Electronic connectors (harnesses, cables, plugs, etc.)●Automotive electronics (detection of patch cords, instrument panels, etc.)●Solar and photovoltaic (silicon wafer solder joint detection)●Testing of special industries such as aviation components●Semiconductor (package component inspection)●LED detection●Electronic module detection●Ceramic product testing

Detail